NEWLY-DESIGNED POLISHING MACHINEUNE A; UENO Y.1980; BULL. JAP. SOC. PRECIS. ENGNG.; JPN; DA. 1980; VOL. 14; NO 1; PP. 43-44Article

SEMICONDUCTOR WAFERS: LOOKING PAST FOUR-INCH.MARKSTEIN HW.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 4 PART. 1; PP. 21-26 (4P.)Article

WAERMEPROBLEME BEIM MIKROKONTAKTIEREN VON HALBLEITERCHIPS = PROBLEME DU TRANSFERT DE CHALEUR LORS DE LA REALISATION DES MICROCONTACTS DES PUCES SEMICONDUCTRICESSEIDOWSKI T.1981; FEINGERAETETECHNIK; ISSN 0014-9683; DDR; DA. 1981; VOL. 30; NO 1; PP. 32-33; BIBL. 5 REF.Article

INFLUENCE OF WORK PLATE SUPPORT ON FLATNESS IN POLISHINGUNE A; UENO Y.1980; BULL. JPN. SOC. PRECIS. ENG.; ISSN 0582-4206; JPN; DA. 1980; VOL. 14; NO 4; PP. 247-248Article

CORRELATION BETWEEN PROCESS-INDUCED IN-PLANE DISTORTION AND WAFER BOWING IN SILICONYAU LD.1978; APPL. PHYS. LETTERS; USA; DA. 1978; VOL. 33; NO 8; PP. 756-758; BIBL. 9 REF.Article

CLEANING WAFERS AFTER BACK-LAPPING.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 60Article

RAISING YIELD AND THROUGHPUT IN FRONT-END WAFER PROCESSING.LOVELESS WL.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 47-50Article

YIELD FROM LAPPING MACHINES IS INCREASED WITH POLYCRISTALLINE DIAMOND LIMIT STOPS.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 4; PP. 138Article

FAULT CLUSTERING: MODELING AND OBSERVATION ON EXPERIMENTAL LSI CHIPS. = ACCUMULATION DE DEFAUTS: MODELISATION ET OBSERVATION SUR DES PAILLETTES EXPERIMENTALES INTEGREES A GRANDE ECHELLEMUEHLDORF EI.1975; I.E.E.E. J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1975; VOL. 10; NO 4; PP. 237-244; BIBL. 14 REF.Article

SIMPLE, EFFICIENT, CLEAN-STEAM GENERATOR FOR OXIDATION OF SEMICONDUCTOR WAFERS.OLMSTEAD JA; RONEN RS.1975; REV. SCI. INSTRUM.; U.S.A.; DA. 1975; VOL. 46; NO 1; PP. 110-112; BIBL. 8 REF.Article

DER INTEGRIERTE SENDERSCHALTKREIS LITHIC LP 2000. = LE CIRCUIT EMETTEUR INTEGRE LITHIC LP 20001974; RADIO FORNSEHEN ELEKTRON.; DTSCH.; DA. 1974; VOL. 23; NO 11; PP. 369Article

ETCHING SOLUTION CONTROLS IC WINDOWS1973; SOLID STATE TECHNOL.; U.S.A.; DA. 1973; VOL. 16; NO 6; PP. 58Serial Issue

RESIN ATTACHMENT OF SEMICONDUCTOR DICE ON TO FILM CIRCUITSNOLAN PCG.1973; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1973; VOL. 12; NO 3; PP. 235-241Serial Issue

BEDINGUNGEN UND KRITERIEN ZUR RATIONALISIERUNG IN DER SILIZIUM-PLANAR-TECHNIK. IV. DIE MECANISCHE STABILITAET DER SUBSTRATSCHEIBE ALS TECHNOLOGISCHE BASIS DES SILIZIUM-PLANAR-PROZESSES = CONDITIONS ET CRITERES POUR LA RATIONALISATION DANS LA TECHNIQUE PLANAR DU SI. IV. LA STABILITE MECANIQUE DU DISQUE SUPPORT COMME BASE TECHNOLOGIQUE DU PROCESSUS PLANAR DU SIKUNZE M; MASLOV A.1972; FEINGERAETETECHNIK; DTSCH.; DA. 1972; VOL. 21; NO 7; PP. 314-315; BIBL. 10 REF.Serial Issue

A SYSTEMS APPROACH TO SEMICONDUCTOR SLICING TO IMPROVE WAFER QUALITY AND PRODUCTIVITYKACHAJIAN GS.1972; SOLID STATE TECHNOL.; U.S.A.; DA. 1972; VOL. 15; NO 9; PP. 59-64Serial Issue

ANALYSIS AND DEVELOPMENT OF A THERMOCOMPRESSION BOND SCHEDULE FOR BEAM LEAD DEVICESADAMS JR; BONHAM HB.1972; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1972; VOL. 8; NO 3; PP. 22-26; BIBL. 6 REF.Serial Issue

HUMIDITY TEST OF PREMOLDED CHIP CARRIERSMARTIN JH; HANLEY LD.1981; IEEE TRANS. COMPON. HYBRIDS MANUF. TECHNOL.; ISSN 0148-6411; USA; DA. 1981; VOL. 4; NO 2; PP. 210-213Article

REVIEW OF FACTORS AFFECTING WARPAGE OF SILICON WAFERSTHEBAULT D; JASTRZEBSKI L.1980; RCA REV.; ISSN 0033-6831; USA; DA. 1980 PUBL. 1981; VOL. 41; NO 4; PP. 592-611; BIBL. 50 REF.Article

WAFER PROCESSING1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 7; PP. 21-34; BIBL. 9 P.Article

ELIMINATION OF PROCESS-INDUCED STACKING FAULTS BY PREOXIDATION GETTERING OF SI WAFERS. II. SI₃N₄ PROCESS.PETROFF PM; ROZGONYI GA; SHENG TT et al.1976; J. ELECTROCHEM. SOC.; U.S.A.; DA. 1976; VOL. 123; NO 4; PP. 565-570; BIBL. 24 REF.Article

HOW TO SPLICE SEMI CONDUCTOR MATERIALS UNDER OPTIMUM CONDITIONS.KOBAYASHI A; KOMINE N; KUNIYOSHI S et al.1973; IN: SOC. MANUF. ENG. CREATIVE MANUF. ENG. PROGRAMS. TECH. PAP.; DEARBORN, MICH.; 1973; DEARBORN, MICH.; SME; DA. 1973; VOL. 212; PP. 1-11; BIBL. 3 REF.Conference Paper

MORE CHIPS FOR YOUR MONEYHERBERT S.1981; CERAM. IND. J.; ISSN 0305-7623; GBR; DA. 1981; VOL. 90; NO 1025; PP. 22-24; 2 P.Article

CONVERTISSEUR A/N 4 1/2 CHIFFRES MONOPUCE1980; INTER ELECTRON.; ISSN 0020-5036; FRA; DA. 1980; NO 313; PP. 39-42; 2 P.Article

FLEX-MOUNT POLISHING OF SILICON WAFERS.BONORA AC.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 20; NO 10; PP. 55-62 (5P.); BIBL. 9 REF.Article

DIRECT WAFER EXPOSURE WITH E-BEAM ALTERNATIVE TO CONVENTIONAL MASK-MAKINGPHOTOFAB TECHNIQUES.HENDERSON RC.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 9; PP. 58-65 (7P.); BIBL. 23 REF.Article